Flow Chart of Integrated Circuit Related Industries

Silicon Wafer Material Sector
    Its main function is to produce monocrystalline silicon polished wafers that can be used for IC manufacturing. It involves process steps such as crystal pulling from melt, ingot cutting, ingot size grinding, wafer slicing, wafer edge grinding, wafer lapping, wafer etching, wafer polishing and wafer final clean. Silicona in Zhuhai is currently responsible for the job and Silicona (Guangzhou) is aiming at similar task with bigger scale of production capability as compared Silicona.

IC Circuit Design Sector
    Its main function is to design the circuitry and functionalities of an IC and convert the design into patterns that carry pre-defined meanings. Currently, ATC in Zhuhai has the function and production tools for IC circuit design within the Group.

Photo Mask Production Sector
    Its main function is to further convert the patterns produced by IC circuit design sector to patterns either of the same scale or reduced in size onto a glass plate known as "mask".

IC Manufacturing Sector
    Its main function is to produce IC chips from monocrystalline silicon polished wafers (from silicon wafer material sector) after repeated processes of photo masking (use mask from photo mask production sector) and etching, oxidation, diffusion or ion implantation, CVD thin film deposition and metal sputtering etc. Companies with the production tools and function as described above are normally referred to as Wafer Foundry. Currently, ACSMC in Zhuhai serves as the Wafer Foundry within the Group as well as being a wafer foundry for IC circuit design companies in the PRC and overseas. As the Group will continue to develop more new products and in anticipation of increased demand for wafer foundry services from customers, Nanker (Guangzhou) will build up a bigger IC manufacturing operation with clean room area at least twice as big as ACSMC in Zhuhai.

IC Testing Sector
    Its main function is to perform IC functional test either before IC package (known as "wafer probing") or after IC package (know as "final testing") to insure the quality of the IC before shipment to customers. Currently, ATC in Zhuhai has the tools and function for wafer probing and Nanker (Guangzhou) has the tools and function for final testing.

IC Packaging Sector
    Its main function is to do IC packaging after wafer probing. It involves steps of wafer saw, IC die bonding, IC wire bonding, IC molding, IC trimming and forming, IC marking, IC final testing, IC sorting and taping if needed. Currently, Nanker (Guangzhou) has the tools and function for the Group's IC packaging.

The Group's manufacturing chain involves all above-mentioned sectors except the photo mask production sector..